MOC2R60-10C Просмотр технического описания (PDF) - Motorola => Freescale
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MOC2R60-10C Datasheet PDF : 8 Pages
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MOC2R60-10 MOC2R60-15
Use care to maintain the minimum spacings as
shown. Safety and regulatory requirements dictate
a minimum of 8.0 mm between the closest points
between input and output conducting paths,
Pins 3 and 7. Also, 0.070 inches distance is
required between the two output Pins, 7 and 9.
Keep pad sizes on Pins 7 and 9 as large as possible for
optimal performance.
0.315” min
[8 mm min]
Figure 16. PC Board Layout Recommendations
0.070” MIN
Each device, when installed in the circuit
shown in Figure 17, shall be capable of
passing the following conducted noise tests:
• IEEE 472 (2.5 KV)
• Lamp Dimmer (NEMA Part DC33, w 3.4.2.1)
• NEMA ICS 2-230.45 Showering Arc
• MIL-STD-461A CS01, CS02 and CS06
Device Under Test
23
79
I F = Rated IF
10 Ω
0.022 µF
Noise
Source
MOV
150 V
Z Load
AC
Supply
Figure 17. Test Circuit for Conducted Noise Tests
Junction
Temperature of
MOC2R60 . . .
Output Chip
No Additional Heatsink
TJ
TC
{ RθJC
Heat Flow
RθCA
With Additional Heatsink
TJ
TC
TS
RθJC
RθCS
RθSA
TA
} Ambient Air
Temperature
TA
Terms in the model signify:
TA = Ambient temperature
TS = Optional additional
heat sink temperature
TC = Case temperature
TJ = Junction temperature
PD = Power dissipation
RθSA = Thermal resistance, heat sink to ambient
RθCA = Thermal resistance, case to ambient
RθCS = Thermal resistance, heat sink to case
RθJC = Thermal resistance, junction to case
Values for thermal resistance components are: RθCA = 36°C/W/in maximum
RθJC = 8.0°C/W maximum
The design of any additional heatsink will determine the values of RθSA and RθCS.
TC – TA = PD (RθCA)
= PD (RθJC) + RθSA), where PD = Power Dissipation in Watts.
Figure 18. Approximate Thermal Circuit Model
X
Thermal measurements
of RθJC are referenced to
the point on the heat tab
indicated with an ‘X’.
Measurements should be
taken with device orientated
along its vertical axis.
6
Motorola Optoelectronics Device Data
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