MECHANICAL DESCRIPTION
The ADD-A-PAK generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

URES
• 175 °C TJ operation
• Low forward voltage drop
• High frequency operation
• Low thermal resistance
• UL pending
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level

BenefitS
• Excellent thermal performances obtained by the usage of exposed direct bonded copper substrate
• High surge capability
• Easy mounting on heatsink