MFG CO.
TSC Corporation
Features
✧ Extremely thin/leadless package
✧ High mounting capability,strong surage with stand,
high reliability.
✧ Pb free version and RoHS compliant
✧ Designed for mounting on small surface.
✧ Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
Mechanical Data
✧ Case :1005 standard package, molded plastic
✧ Terminal: Gold plated, solderable
per MIL-STD-750, method 2026 guaranteed
✧ High temperature soldering guaranteed: 260°C/10s
✧ Polarity : Indicated by cathode band
✧ Weight : 0.006 gram (approximately)
Part Name
Description
PDF
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