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NTSAF545T3G(2015) Datasheet - ON Semiconductor

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Part Name
NTSAF545T3G

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5 Pages

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MFG CO.
ONSEMI
ON Semiconductor ONSEMI

Features
• Fine Lithography Trench−based Schottky Technology for Very Low
   Forward Voltage and Low Leakage
• Fast Switching with Exceptional Temperature Stability
• Low Power Loss and Lower Operating Temperature
• Higher Efficiency for Achieving Regulatory Compliance
• High Surge Capability
• These are Pb−Free and Halide−Free Devices

Typical Applications
• Switching Power Supplies including Tablet Adapters, and Flat Panel
   Display
• High Frequency and DC−DC Converters
• Freewheeling and OR−ing diodes
• Reverse Battery Protection
• Instrumentation

Mechanical Characteristics:
• Case: Epoxy, Molded
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
• Lead and Mounting Surface Temperature for Soldering Purposes:
   260°C Max. for 10 Seconds
• Device Meets MSL 1 Requirements
• Weight: 95 mg (Approximately)
• Cathode Polarity Band


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