MUR3060G Datasheet - Thinki Semiconductor Co., Ltd.
Part Name
MUR3060G
Other PDF
no available.
PDF
page
2 Pages
File Size
408.9 kB
MFG CO.
Thinki Semiconductor Co., Ltd.
Features
◆ Glass passivated chip junction EPI wafer
◆ Ultrafast recovery time for high efficiency
◆ Low reverse leakage current
◆ High surge capacity
Mechanical Data
◆ Case: TO-220AC heatsink
◆ Terminals: Lead solderable per MIL-STD-202, Method 208
◆ Polarity: As marked
◆ Standard packaging: Any
◆ Weight: 2.5 gram approximately
Part Name
Description
PDF
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GLASS PASSIVATED JUNCTION ULTRAFAST RECOVERY RECTIFIER ( Rev : 2009 )
PANJIT INTERNATIONAL
GLASS PASSIVATED JUNCTION ULTRAFAST RECOVERY RECTIFIER ( Rev : 2004 )
PANJIT INTERNATIONAL
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