FEATURES
• Total power dissipation:max.300 mW
• Small plastic package suitable for surface mounted design
• Tolerance approximately ±5%
• High temperature soldering guaranteed:260℃/10 seconds at terminals
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
MECHANICAL DATA
• Case: SOD-323 plastic case
• Weight: Approx. 0.004 gram