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MLF2012DR33MT(2007) Datasheet - TDK Corporation

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Part Name
MLF2012DR33MT

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3 Pages

File Size
50.9 kB

MFG CO.
TDK
TDK Corporation TDK

FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of compact circuits with high packing density.
• Excellent solderability and high heat resistance permits either flow or reflow soldering.
• The products contain no lead and also support lead-free soldering.
• It is a product conforming to RoHS directive.


APPLICATIONS
    Digital cellular phone, car audio, TV, personal computers, or various electronic appliances.

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