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MBRF10100D Datasheet - TSC Corporation

MBRF10100D image

Part Name
MBRF10100D

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page
2 Pages

File Size
156.7 kB

MFG CO.
TSC
TSC Corporation TSC

Features
Metal silicon junction, majority carrier conduction
Low power loss, high efficiency
High current capability, low forward voltage drop
High Surge capability
Guarding for overvoltage protection
High temperature soldering guaranteed: 260℃/0 seconds, 0.25"(6.35mm) from case
Plastic material used carries Underwriters Laboratory
  Classifications 94V-0
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
Green compound with suffix "G" on packing code & prefix "G" on datecode

Page Link's: 1  2 

Part Name
Description
PDF
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