□ Features
- For surface mounted applications
- Low profile package
- Built-in strain relief
- Metal silicon junction, majority carrier conduction
- Low power loss, high efficiency
- High current capability, low forward voltage drop
- High temperature soldering guaranteed
- High reliability
- High surge current capability
- Epitaxial construction
- Lead free device
- ESD sensitive product handling required

□ Mechanical data
- Case： Molded plastic
- Epoxy： UL 94V-0 rate flame retardant
- Terminals： Solder plated, solderable per MIL-STD-750,method 2026
- Polarity： Color band denotes cathode end