DESCRIPTION
Third Generation HEXFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.

• Isolated Package
• High Voltage Isolation = 2.5KVRMS
• Sink to Lead Creepage Dist. = 4.8mm
• Logic-Level Gate Drive
• RDS (on) Specified at VGS = 4V & 5V
• Fast Switching
• Ease of Paralleling