Mechanical Description
The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

FEATUREs
■ High Voltage
■ Industrial Standard Package
■ Thick Al metal die and double stick bonding
■ Thick copper baseplate
■ UL E78996 approved
■ 3500VRMS isolating voltage

Benefits
■ Up to 1600V
■ Full compatible TO-240AA
■ High Surge capability
■ Easy Mounting on heatsink
■ Al203 DBC insulator
■ Heatsink grounded