DESCRIPTION
• N-channel enhancement mode
• For additional characteristic and max ratings refer to the datasheet of IPP048N12N3 G 1)
• AQL 0.65 for visual inspection according to failure catalogue
• Electrostatic Discharge Sensitive Device according to MIL-STD 883C
• Die bond: soldered or glued
• Backside metallization: NiV system
• Frontside metallization: AlSi system
• Passivation: nitride (only on edge structure)