High efficiency and thermal performance combine in a full isolated solution

the new fullPAK solution combines the high electrical performance standards of infineon second generation Sic Schottky diodes and the advantages of a full isolated package, without significant impact on thermal behavior compared to standard to-220 solutions.
the patented diffusion soldering technique enables to consistently reduce the “chip-to-leadframe” thermal resistance and positions infineon fullPAK products as best-in-class performance. Additionally, infineon offers the industry´s broadest portfolio in this package with current ratings up to 6A.

FEATUREs and benefits
◾ thermal behavior comparable to
   non-isolated package thanks
   to infineon diffusion soldering
◾ Best thermal performance for
   full-pack solutions
◾ comparable price to non isolated
   package
◾ Mounting without isolating
   bushing and foil

APPLICATIONs
◾ SMPS e.g. ccM Pfc
◾ Lcd, PdP
◾ Lighting
◾ uPS, Solar applications
◾ Motor drives