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GBJ35J Datasheet - GeneSiC Semiconductor, Inc.

GBJ35J image

Part Name
GBJ35J

Other PDF
  2016  

PDF
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page
3 Pages

File Size
1,005.4 kB

MFG CO.
GENESIC
GeneSiC Semiconductor, Inc. GENESIC

Features
• Epoxy Resin material compliant with 94V-0 standards
   of UL Material Flammability Provisions
• Compliant with RoHS Provisions
• Single in-line DIP package, compact size
• Low forward voltage, high forward current
• High surge current capability
• Types from 600 V to 1000 V VRRM
• Small size, high heat-conducting performance
• Thermal welding performance: 260 °C/10 s
• Weight: 7.25 g (0.25 Oz)
• Not ESD Sensitive


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