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ETSC1208-1F Datasheet - Micross Components

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ETSC1208-1F

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MFG CO.
MICROSS
Micross Components MICROSS

Embedded & Wirebond Temperature Silicon Capacitor

ETSC provides the highest capacitor stability over the full -55°C/+200°C temperature range in the market with a TC<1%.
The IPDiA technology offers industry leading performances relative to failure rate with a FIT <0.017.
This technology also offers high reliability, up to 10 times better than alternative capacitor technologies & eliminates cracking phenomena.
This silicon based technology is RoHS compliant and compatible with lead free reflow soldering process.


KEY FEATUREs
• Low Profile (250µm)
• High Stability of Capacitance Value;
   • Temperature <±1% (-55 to +200°C)
   • Voltage < 0.1 % / V
   • Negligible Capacitance Loss through Ageing
• High Reliability
• Low Leakage Current down to 100pA
• High Operating Temperature (200°C)
• High Reliability
• Different Pad finishing available (Al, Au, Ni/Au)

Key Applications
• All Applications up to 200°C, such as Defense. Downhole & Automotive Industries.
• High Reliability Applications
• Decoupling / Filtering / Charge Pipe (ie. Motor Management, Temperature Sensors)
• Replacement of X7R and C0G dielectrics
• Downsizing Part Numb


Part Name
Description
PDF
MFG CO.
Embedded & Wirebond Extreme Temperature Silicon Capacitor
Micross Components
Embedded & Wirebond Extreme Temperature Silicon Capacitor
Micross Components
Embedded & Wirebond Silicon Capacitor
Micross Components
Embedded & Wirebond Extreme Temperature Silicon Capacitor
Micross Components
Embedded & Wirebond Extreme Temperature Silicon Capacitor
Micross Components
Embedded & Wirebond Extreme Temperature Silicon Capacitor
Micross Components
Embedded & Wirebond Silicon Capacitor
Micross Components
Embedded Silicon Capacitor
Micross Components
Embedded Silicon Capacitor
Micross Components
High Temperature Silicon Capacitor
Micross Components

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