DSI30-08AC Datasheet - IXYS CORPORATION
Part Name
DSI30-08AC
Other PDF
no available.
PDF
page
1 Pages
File Size
78.4 kB
MFG CO.
IXYS CORPORATION
Features
• Silicon chip on Direct-Copper-Bond substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
• Low cathode to tab capacitance(15pF typical)
• International standard package
• Epoxy meets UL 94V-0
Part Name
Description
PDF
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