Features
• Isolated Substrate
− high isolation voltage (>2500V)
− excellent thermal transfer
− Increased temperature and power cycling capability
• IXYS advanced low Qg process
• Low gate charge and capacitances
− easier to drive
− faster switching
• Low RDS(on)
• Very low insertion inductance (<2nH)
• No beryllium oxide (BeO) or other hazardous materials
Advantages
• High Performance Push-Pull RF Package
• Optimized for RF and high speed switching at frequencies to >65MHz
• Easy to mount—no insulators needed
• High power density