DDB6U75N16W1R_B11 Datasheet - Infineon Technologies
Part Name
DDB6U75N16W1R_B11
Description
Other PDF
no available.
PDF
page
9 Pages
File Size
530.4 kB
MFG CO.
Infineon Technologies
Electrical Features
• Unbeatable Robustness
• Trench IGBT 4
Mechanical Features
• Al2O3 Substrate with Low Thermal Resistance
• Compact design
• PressFIT Contact Technology
• Rugged mounting due to integrated mounting clamps
Typical Applications
• Auxiliary Inverters
• Air Conditioning
• Motor Drivers
Part Name
Description
PDF
MFG CO.
SmartPIM1 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2009 )
Infineon Technologies
SmartPIM1 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
SmartPIM module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2009 )
Infineon Technologies
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