MFG CO.
Chip Integration Technology Corporation
■ Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Suffix "G" indicates Halogen-free part, ex.CSP20S60SG-A.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
■ Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : Molded plastic, TO-277.
• Lead : Solder plated, solderable per MIL-STD-750,
Method 2026.
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight : Approximated 0.093 grams.
Part Name
Description
PDF
MFG CO.
20A SURFACE MOUNT SCHOTTKY BARRIER DIODE
Zibo Seno Electronic Engineering Co.,Ltd
20A SURFACE MOUNT SCHOTTKY BARRIER DIODE ( Rev : V2 )
Zibo Seno Electronic Engineering Co.,Ltd
20A SURFACE MOUNT SCHOTTKY BARRIER DIODE
Zibo Seno Electronic Engineering Co.,Ltd
20A Low Barrier Diode
Chip Integration Technology Corporation
20A Low Barrier Diode
Chip Integration Technology Corporation
20A Low Barrier Diode
Chip Integration Technology Corporation
20A Low Barrier Diode
Chip Integration Technology Corporation
20A Trench Low Barrier Diode
Chip Integration Technology Corporation
20A Trench Low Barrier Diode
Chip Integration Technology Corporation
20A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Diodes Incorporated.