CPD94X Datasheet - Central Semiconductor
Part Name
CPD94X
Description
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2 Pages
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663.5 kB
MFG CO.
Central Semiconductor
PROCESS DETAILS
Die Size 20 x 20 MILS
Die Thickness 5.9 MILS
Anode Bonding Pad Area 16 x 16 MILS
Top Side Metalization Al - 20,000Å
Back Side Metalization Au - 12,000Å
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MFG CO.
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