PROCESS DETAILS
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   Process                      EPITAXIAL PLANAR
   Die Size                     41.3 x 41.3 MILS
   Die Thickness                         9.0 MILS
   Base Bonding Pad Area        9.5 x 9.2 MILS
   Emitter Bonding Pad Area      12.8 x 10.2 MILS
   Top Side Metalization              Al - 30,000Å
   Back Side Metalization            Au - 18,000Å