B260W-ST Datasheet - Chip Integration Technology Corporation
Part Name
B260W-ST
Description
Other PDF
no available.
PDF
page
3 Pages
File Size
54.4 kB
MFG CO.
Chip Integration Technology Corporation
Features
• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.B220WG-ST.
• Lead-free parts meet environmental standards of MIL-STD-19500 /228
Part Name
Description
PDF
MFG CO.
2A Surface Mount Schottky Barrier Rectifiers
( Rev : 2012 )
Chip Integration Technology Corporation
2A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
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