Additional technical data

Ambient temperature max. Ta                         –55 °C to +90 °C
Recommended continuous operatingcurrent at    23°C      0,7 . In
Climatic category                                          55/090/21 according to IEC 60068-1
Solderability (Reflow- soldering)                       235 °C, 2 sec. (215 °C, 3 sec.) according to IEC 60068-2-58
Soldering heat resistance                                260 °C, 10 sec.,
Fuse-link temperature rise ≤ 75 K (UL/CSA) trackwidth: 5 mm
                                            according to IEC 60068-2-58
mperaturerhöhungen am Si-Einsatz                  ≤ 75 K (UL/CSA) according to IEC 60127-4
Storage temperature max.                              40 °C at 70% r. H. / r. F.
Materials Housing                                        Glass epoxy, flammability class UL94V-0 inals / Cu / Sn
Net weight pieces %                                     0,12 g