FEATURES
• For surface mounted applications in order to optimize board space
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Low inductance
• Excellent clamping capability
• Repetition Rate(duty cycle):0.05%
• Fast response time: typically less than 1.0ps from 0 Volts to BV min.
• Typical IR less than 1mA above 10V
• High temperature soldering: 250°C/10 seconds at terminals