Embedded Package-on-Package Memory for Wearables

   Kingston’s ePoP provides a highly integrated JEDEC standard component that combines Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Package-on-Package (PoP) solution. ePoP is mounted directly on top of a compatible host System-on-a-Chip (SoC), which reduces Printed Circuit Board (PCB) space, and ensures optimum performance. ePoP is an ideal solution for space constrained applications such as wearables.

KEY BENEFITS
• By mounting directly on top of a host SoC, ePoP provides an ideal
   solution for small form factor applications such as wearables.
• Low-Power DRAM and optimized storage fi rmware reduces power
   consumption while delivering the high performance needed for battery
   powered wearable applications.
• Simplifi es system design, reduces time to market, and shortens the
   qualifi cation cycle.
• Multiple fi rmware confi gurations available to best fi t your application
   requirements for performance, power, and life span.