FEATURES
• Glass passivated chip junction
• Ultrafast recovery time
• Soft recovery characteristics
• Low switching losses, high efficiency
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
• Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package)
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC