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UFR301
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Shenzhen Taychipst Electronic Co., Ltd
UFR301 데이터시트 - Shenzhen Taychipst Electronic Co., Ltd
Shenzhen Taychipst Electronic Co., Ltd
FEATURES
PROPRIETARY SOFT GLASS® JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
LOW SWITCHING NOISE
LOW THERMAL RESISTANCE
HIGH SWITCHING CAPABILITY
LOW FORWARD VOLTAGE DROP
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