Features
 • For surface mount application in order to optimize board space
 • Low inductance
 • Low profile package
 • Built-in strain relief
 • Glass passivated junction
 • Excellent clamping capability
 • Repetition Rate( duty cycle): 0.05%
 • Fast response time: typical less than 1ps from 0V to BV min
 • Typical ID less than 1uA above 10V
 • High temperature soldering: 260oC/10 seconds at terminals
 • Plastic package has Underwrites Laboratory Flammability Classification 94V-O