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RS1GL
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Sangdest Microelectronic (Nanjing) Co., Ltd
RS1GL 데이터시트 - Sangdest Microelectronic (Nanjing) Co., Ltd
Sangdest Microelectronic (Nanjing) Co., Ltd
Features
• Glas passivated device
• Ideal for surface mouted applications
• Low reverse leakage
• Metallurgically bonded construction
• High temperature soldering guaranteed: 260 C/10
seconds,0.375” (9.5mm) lead length, 5 lbs. (2.3kg)
tension
• Plastic material-UL flammability 94V-0
• This is a Halogen Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request
Mechanical Data
• Case: SOD-123FL, molded plastic
• Terminals: Plated leads, solderable per MIL-STD-750,
Method 2026
• Polarity: Color band dentes cathode end
• Mounting Position: Any
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