Features
● Glass passivated chip junction KBJ
● Reliable low cost construction utilizing molded
   plastic technique
● Ideal for printed circuit board
● Low forward voltage drop
● Low reverse leakage current
● High surge current capability
● This is a Pb − Free Device
● All SMC parts are traceable to the wafer lot
● Additional testing can be offered upon request

Mechanical Data
● Case: Molded plastic, KBJ
● Epoxy: UL 94V-O rate flame retardant
● Terminals: Leads solderable per MIL-STD-202,
   method 208 guaranteed
● Mounting position: Any
● Weight: 0.16ounce, 4.6gram