Features
• Silicon Chip on Direct-Copper Bond (DCB) Substrate
• Isolated Mounting Surface
• 2500V~ Electrical Isolation
• Optimized for 10-30kHz Switching
• Square RBSOA
• Short Circuit Capability
• Anti-Parallel Sonic Diode
• High Current Handling Capability

APPLICATIONs
• Power Inverters
• UPS
• Motor Drives
• SMPS
• PFC Circuits
• Battery Chargers
• Welding Machines
• Lamp Ballasts
• High Frequency Power Inverters

Advantages
• High Power Density
• Low Gate Drive Requirement