HS3F(V_B07) 데이터시트 - TSC Corporation
제조사

TSC Corporation
Features
✧ Glass passivated junction chip.
✧ For surface mounted application
✧ Low forward voltage drop
✧ Low profile package
✧ Built-in stain relief, ideal for automatic
placement
✧ Fast switching for high efficiency
✧ High temperature soldering:
260oC/10 seconds at terminals
✧ Plastic material used carries Underwriters
Laboratory Classification 94V0
Mechanical Data
✧ Cases: Molded plastic
✧ Terminals: Pure tin plated, lead free
✧ Polarity: Indicated by cathode band
✧ Packing: 16mm tape per EIA STD RS-481
✧ Weight: 0.21 gram
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