FZ1200R17HE4P 데이터시트 - Infineon Technologies
제조사

Infineon Technologies
Electrical Features
• Extended operating temperature Tvjop
• Low switching losses
• Low VCEsat
• Tvjop=150°C
Mechanical Features
• 4 kV AC 1min insulation
• Package with CTI > 400
• High creepage and clearance distances
• High power density
• IHM B housing
• Copper base plate
• RoHS compliant
• Pre-applied Thermal Interface Material
Typical Applications
• High power converters
• Motor drives
IHM-B module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and pre-applied Thermal Interface Material
Infineon Technologies
IHM-B module with fast Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies
IHM-B module with fast Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies
IHM-B module with fast Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and pre-applied Thermal Interface Material
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC / pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™4 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies