FS50R12W2T4_B11(2009) 데이터시트 - Infineon Technologies
제조사

Infineon Technologies
Electrical Features
• Low Switching Losses
• Trench IGBT 4
• VCEsat with positive Temperature Coefficient
• Low VCEsat
Mechanical Features
• Al2O3 Substrate with LowThermal Resistance
• Compact design
• PressFIT Contact Technology
• Rugged mounting due to integrated mounting
clamps
Typical Applications
• Air Conditioning
• Motor Drives
• Servo Drives
• UPS Systems
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC ( Rev : 2009 )
Infineon Technologies