FP50R06W2E3(2009) 데이터시트 - Infineon Technologies
제조사

Infineon Technologies
Electrical Features
• Low Switching Losses
• Trench IGBT 3
• VCEsat with positive Temperature Coefficient
• Low VCEsat
Mechanical Features
• Al2O3 Substrate with Low Thermal Resistance
• Compact design
• Solder Contact Technology
• Rugged mounting due to integrated mounting
clamps
Typical Applications
• Auxiliary Inverters
• Air Conditioning
• Motor Drives
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC
Infineon Technologies
EconoPIM™3 module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC
Infineon Technologies
EconoDUAL™3 module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies