
Dallas Semiconductor -> Maxim Integrated
GENERAL DESCRIPTION
The DS3171, DS3172, DS3173, and DS3174 (DS317x) combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper lines.
FEATURES
◾ Single (DS3171), Dual (DS3172), Triple
(DS3173), or Quad (DS3174) Single-Chip
Transceiver for DS3 and E3
◾ All Four Devices are Pin Compatible for Ease of
Port Density Migration in the Same Printed
Circuit Board Platform
◾ Each Port Independently Configurable
◾ Performs Receive Clock/Data Recovery and
Transmit Waveshaping for DS3 and E3
◾ Jitter Attenuator can be Placed Either in the
Receive or Transmit Paths
◾ Interfaces to 75 Coaxial Cable at Lengths Up to
380 meters, or 1246 feet (DS3) or 440 meters, or
1443 feet (E3)
◾ Uses 1:2 Transformers on Both Tx and Rx
◾ On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or
G.832) Framer(s)
◾ Ports Independently Configurable for DS3, E3
◾ Built-In HDLC Controllers with 256-Byte FIFOs
for the Insertion/Extraction of DS3 PMDL, G.751
Sn Bit, and G.832 NR/GC Bytes
◾ On-Chip BERTs for PRBS and Repetitive Pattern
Generation, Detection, and Analysis
◾ Large Performance-Monitoring Counters for
Accumulation Intervals of at Least 1 Second
◾ Flexible Overhead Insertion/Extraction Ports for
DS3, E3 Framers
APPLICATIONS
Access Concentrators
Multiservice Access Platform (MSAP)
SONET/SDH ADM and Muxes
PBXs
Multiservice Protocol Platform (MSPP)
Digital Cross Connect
Test Equipment
PDH Multiplexer/Demultiplexer
Routers and Switches
Integrated Access Device (IAD)