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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크
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CPD92X 데이터시트 - Central Semiconductor

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CPD92X

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Central-Semiconductor
Central Semiconductor 

PROCESS DETAILS
   Process EPITAXIAL PLANAR
   Die Size 9.0 x 9.0 MILS
   Die Thickness 5.9 MILS
   Anode Bonding Pad Area 4.8 MILS DIAMETER
   Top Side Metalization Al - 30,000Å
   Back Side Metalization Au - 12,000Å


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