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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크
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BYX101 데이터시트 - Philips Electronics

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BYX101

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8 Pages

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40.4 kB

제조사
Philips
Philips Electronics 

DESCRIPTION
Rugged glass package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.

FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Recovery times ranging from 600 to 50 ns
• Soft-recovery switching characteristics
• Compact construction.

APPLICATIONS
• High-voltage power supply units in, for example, X-ray or radar systems.

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