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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크
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BYG23MR2G 데이터시트 - TSC Corporation

BYG23M image

부품명
BYG23MR2G

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page
4 Pages

File Size
369.7 kB

제조사
TSC
TSC Corporation 

FEATURES
- Glass passivated junction chip.
- Ideal for automated placement
- Fast switching for high efficiency
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
- AEC-Q101 available

TYPICAL APPLICATION
    The superior avalanche capability of BYG23M is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications.

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