BYD11G 데이터시트 - Philips Electronics
제조사

Philips Electronics
DESCRIPTION
Cavity free cylindrical glass package through Implotec™(1) technology.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.
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