FEATURES
   In a COG display, a bare IC called “gold bump” or “flip chip” is connected to transparent traces on the LCD glass (no PCB needed).

COMPACT: very space economical, modules can be as thin as 2 mm

INEXPENSIVE: cost effective over COB & SMT modules, especially for graphic LCD’s, because less ICs required and no PCBs used

RELIABLE: more durable than TAB and COF (chip-on-flex) modules because of the weakness in the bond area of TAB and COF.