FEATURES
● For surface mounted applications in order to optimize board space
● Low profile package
● Built-in strain relief
● Glass passivated junction
● Low inductance
● Excellent clamping capability
● Typical ID less than 1 £gA above 11V
● High temperature soldering : 260 ¢J/10 seconds at terminals
● Plastic package has Underwriters Laboratory Flammability Classification 94V-O