1N58011 데이터시트 - Microsemi Corporation
제조사
Microsemi Corporation
FEATURES:
· Chip Outline Dimensions: 68 x 68 mils
· Chip Thickness: 8 to 12 mils
· Anode Metallization: Aluminum
· Metallization Thickness: 70,000ÃNominal
· Bonding Area: 42 x 42 mils Min.
· Back Metallization: Gold-3000ÃNominal
· Junction Passivated with Thermal Silicon Dioxide - Planar Design
· Backside Available with Solderable Ag Backside as JANHCF or JANKCF
6 AMPS FAST RECOVERY RECTIFIER CHIP 50 - 150 VOLTS ( Rev : 1999 )
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DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD
