FEATURES
· Glass passivated chip junction
· Low forward voltage drop
· Low reverse leakage
· High forward surge current capability
· High temperature soldering guaranteed: 260℃/10 secods,0.375”(9.5mm)lead length at 5 lbs(2.3kg) tension

MECHANICAL DATA
· Case: Transfer molded plastic
· Epoxy: UL94V-0 rate flame retardant
· Polarity: Color band denotes cathode end
· Lead: Plated axial lead, solderable per MIL-STD-202E method 208C
· Mounting position: Any
· Weight: 0.007ounce, 0.20 grams