R6576ENZ4
lThermal resistance
Parameter
Thermal resistance, junction - case
Thermal resistance, junction - ambient
Soldering temperature, wavesoldering for 10s
Datasheet
Symbol
RthJC*4
RthJA
Tsold
Values
Unit
Min. Typ. Max.
-
- 0.17 ℃/W
-
- 30 ℃/W
-
- 265 ℃
lElectrical characteristics (Ta = 25°C)
Parameter
Symbol
Conditions
Values
Unit
Min. Typ. Max.
Drain - Source breakdown
voltage
V(BR)DSS VGS = 0V, ID = 1mA
650 -
-
V
Zero gate voltage
drain current
Gate - Source leakage current
Gate threshold voltage
Static drain - source
on - state resistance
Gate resistance
VDS = 600V, VGS = 0V
IDSS Tj = 25°C
-
- 100 μA
Tj = 125°C
-
- 1000
IGSS VGS = ±20V, VDS = 0V
-
- ±100 nA
VGS(th) VDS = VGS, ID = 2.96mA 2.0
-
4.0
V
VGS = 10V, ID = 44.4A
RDS(on)*5 Tj = 25°C
- 0.040 0.046 Ω
Tj = 125°C
- 0.080 -
RG f = 1MHz, open drain
- 0.7 - Ω
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20190521 - Rev.002