LTC7000MPMSE-1-PBF 데이터 시트보기 (PDF) - Analog Devices

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LTC7000MPMSE-1-PBF

Fast 150V Protected High Side NMOS Static Switch Driver

Analog Devices 

LTC7000/LTC7000-1

PACKAGE DESCRIPTION

MSE Package

Variation: MSE16 (12)

16-Lead Plastic MSOP with 4 Pins Removed

Exposed Die Pad

(Reference LTC DWG # 05-08-1871 Rev D)

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.845 ±0.102

2.845 ±0.102

(.112 ±.004)

0.889 ±0.127

(.112 ±.004)

(.035 ±.005)

1

8

0.35

REF

5.10

(.201)

MIN

1.651 ±0.102 3.20 – 3.45

(.065 ±.004) (.126 – .136)

0.305 ±0.038

(.0120 ±.0015)

TYP

0.50

(.0197)

1.0 BSC

(.039)

BSC

RECOMMENDED SOLDER PAD LAYOUT

0.254

(.010)

DETAIL “A”

0° – 6° TYP

GAUGE PLANE

4.90 ±0.152

(.193 ±.006)

1.651 ±0.102

(.065 ±.004)

0.12 REF

DETAIL “B”

CORNER TAIL IS PART OF

DETAIL “B” THE LEADFRAME FEATURE.

16

9

4.039 ±0.102

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

(.159 ±.004)

(NOTE 3)

0.280 ±0.076

16 14 121110 9

(.011 ±.003)

REF

3.00 ±0.102

(.118 ±.004)

(NOTE 4)

0.18

(.007)

0.53 ±0.152

(.021 ±.006)

DETAIL “A”

1

1.10

(.043)

MAX

3 5678

1.0

(.039)

BSC

0.86

(.034)

REF

SEATING

PLANE 0.17 – 0.27

0.1016 ±0.0508

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

(.007 – .011)

TYP

0.50

(.0197)

BSC

(.004 ±.002)

MSOP (MSE16(12)) 0213 REV D

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL

NOT EXCEED 0.254mm (.010") PER SIDE.

Rev. E

28

For more information www.analog.com

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