
MITSUBISHI SEMICONDUCTORS <HVIC>
M63994P/FP
PACKAGE OUTLINE
HIGH VOLTAGE HALF BRIDGE DRIVER
8P4
EIAJ Package Code
DIP8-P-300-2.54
JEDEC Code
–
Weight(g)
0.5
Lead Material
Cu Alloy
Plastic 8pin 300mil DIP
8
5
1
4
D
SEATING PLANE
b1
b
b2
e
8P2S-A
EIAJ Package Code
SOP8-P-225-1.27
JEDEC Code
–
Weight(g)
0.07
Lead Material
Cu Alloy
8
5
Symbol
A
A1
A2
b
b1
b2
c
D
E
e
e1
L
Dimension in Millimeters
Min Nom Max
–
–
4.5
0.51
–
–
–
3.3
–
0.4
0.5
0.6
1.4
1.5
1.8
0.9
1.0
1.3
0.22 0.27 0.34
8.7
8.9
9.1
6.15 6.3
6.45
–
2.45
–
–
7.62
–
3.0
–
–
0°
–
15°
Plastic 8pin 225mil SOP
e
b2
1
4
D
b
e
F
A
y
A2
A1
c
Detail F
Recommended Mount Pad
Symbol
A
A1
A2
b
c
D
E
e
HE
L
L1
y
b2
e1
I2
Dimension in Millimeters
Min Nom Max
–
–
1.9
0.05
–
–
–
1.5
–
0.35 0.4
0.5
0.13 0.15 0.2
4.8
5.0
5.2
4.2
4.4
4.6
–
1.27
–
5.9
6.2
6.5
0.2
0.4
0.6
–
0.9
–
–
–
0.1
0°
–
10°
–
0.76
–
–
5.72
–
1.27
–
–
Sep. 2000