NCP161AMX180TBG(2015) 데이터 시트보기 (PDF) - ON Semiconductor
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NCP161AMX180TBG
(Rev.:2015)
(Rev.:2015)
ON Semiconductor
NCP161AMX180TBG Datasheet PDF : 19 Pages
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NCP161
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP161 can handle
is given by:
PD(MAX)
+
ƪ125oC *
qJA
TAƫ
(eq. 1)
160
150
The power dissipated by the NCP161 for given
application conditions can be calculated from the following
equations:
PD [ VIN @ IGND ) IOUTǒVIN * VOUTǓ (eq. 2)
1.6
PD(MAX), TA = 25°C, 2 oz Cu
1.4
140
PD(MAX), TA = 25°C, 1 oz Cu
1.2
130
1.0
120
0.8
110
qJA, 1 oz Cu
0.6
100
90
80
0
qJA, 2 oz Cu
100
200
300
400
500
600
PCB COPPER AREA (mm2)
Figure 50. qJA and PD (MAX) vs. Copper Area (CSP4)
0.4
0.2
0
700
220
1.0
qJA, 2 oz Cu
210
0.9
200
0.8
qJA, 1 oz Cu
190
0.7
PD(MAX), TA = 25°C, 2 oz Cu
PD(MAX), TA = 25°C, 1 oz Cu
180
0.6
170
0.5
160
150
0
100
200
300
400
500
600
PCB COPPER AREA (mm2)
Figure 51. qJA and PD (MAX) vs. Copper Area (XDFN4)
0.4
0.3
700
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