Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
SIDE VIEW
0.65
BSC
0.35
0.30
0.25
13
12
16
1
EXPOSED
PAD
DETAIL A
(JEDEC 95)
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
2.60
2.50 SQ
2.40
0.50
0.40
0.30
9
4
8
5
BOTTOM VIEW
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC-3.
Figure 48. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-26)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADP2164ACPZ-R7
ADP2164ACPZ-1.0-R7
ADP2164ACPZ-1.2-R7
ADP2164ACPZ-1.5-R7
ADP2164ACPZ-1.8-R7
ADP2164ACPZ-2.5-R7
ADP2164ACPZ-3.3-R7
ADP2164-EVALZ
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Output Voltage
Adjustable
1.0 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
Package Description
16-Lead LFCSP
16-Lead LFCSP
16-Lead LFCSP
16-Lead LFCSP
16-Lead LFCSP
16-Lead LFCSP
16-Lead LFCSP
Evaluation Board
ADP2164
Package Option
CP-16-26
CP-16-26
CP-16-26
CP-16-26
CP-16-26
CP-16-26
CP-16-26
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registered trademarks are the property of their respective owners.
D09944-0-6/18(C)
Rev. C | Page 19 of 19