BGA2022 데이터 시트보기 (PDF) - NXP Semiconductors.
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BGA2022 Datasheet PDF : 9 Pages
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NXP Semiconductors
MMIC mixer
PACKAGE OUTLINE
Plastic surface-mounted package; 6 leads
D
B
Product specification
BGA2022
SOT363
E
A
X
y
6
5
4
pin 1
index
1
2
e1
bp
e
3
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e1
HE Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30 0.25
0.20 0.10
2.2 1.35 1.3
1.8 1.15
0.65 2.2 0.45 0.25 0.2
2.0 0.15 0.15
0.2
0.1
OUTLINE
VERSION
IEC
SOT363
REFERENCES
JEDEC
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
2000 Dec 04
6
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